CONVUM

This ESD rubber pad is designed to provide electrostatic discharge protection during the handling of semiconductors and electronic components. Its surface resistance is controlled within the range of 10⁶–10⁹ Ω, helping to reduce the risk of electrostatic damage to sensitive electronic devices.

This hygienic suction pad features antibacterial properties and complies with the Japanese Food Sanitation Act and applicable FDA requirements. It is designed for food handling and suction applications in food processing environments.

Utilizing our proprietary bonding, molding, and processing technologies, we have realized high-precision, adhesive-free O-rings and large-scale high-precision gaskets. We propose their implementation in semiconductor manufacturing equipment, such as wafer stages.