TATSUTA Electric Wire and Cable

By controlling carbon fiber orientation, we achieved an extremely high Z-direction thermal conductivity of 550 W/m·K, surpassing copper (402 W/m·K). Simulations confirm a thermal resistance reduction of approximately 45% compared to copper-based substrates. With a low density of 2.0 g/cm³, it simultaneously improves heat dissipation and reduces device weight.

Despite being an epoxy resin, this molding material achieves a thermal conductivity of 200 W/m·K. We propose it as a replacement for conventional metal-cut parts and a process efficiency booster for power semiconductor (SiC/GaN device) heat receiver components and communication module heat dissipation parts.

A molding material achieving a coefficient of thermal expansion (CTE) of 0 ppm/K (α1). By eliminating CTE mismatches between dissimilar materials, it solves reliability issues such as warpage, peeling, and cracking caused by thermal stress. It is ideal for stabilizing the optical axis of optical components and structural design in precision equipment.